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mc145010 rev 6, 05/2005 freescale semiconductor technical data ? freescale semiconductor, in c., 2005. all rights reserved. photoelectric smoke detector ic with i/o the cmos mc145010 is an advanced sm oke detector component containing sophisticated very-low-power analog and digital circuitry. the ic is used with an infrared photoelectric chamber. detection is accomplished by sensing scattered light from minute smoke particles or other aerosols. when detection occurs, a pulsating alarm is sounded via on-chip push-pull drivers and an external piezoelectric transducer. the variable-gain photo amplifier allows direct interface to ir detectors (photodiodes). two external capacitors, c1 and c2, c1 being the larger, determine the gain settings. low gain is selected by the ic during most of the standby state. medium gain is selected during a local-smoke condition. high gain is used during push button test. during standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain, also. the i/o pin, in combination with v ss , can be used to interconnect up to 40 units for common signaling. an on-chip current sink provides noise immunity when the i/o is an input. a local-smok e condition activates the short-circuit- protected i/o driver, thereby signaling remote smoke to the interconnected units. additionally, the i/o pin can be used to acti vate escape lights, enable auxiliary or remote alarms, and/or initiate auto-dialers. while in standby, the low-supply detection circuitry conducts periodic checks using a pulsed load current from the led pin. the trip point is set using two external resistors. the supply fo r the mc145010 can be a 9 v battery. a visible led flash accompanying a pulsating audible alarm indicates a local- smoke condition. a pulsating audible alarm with no led flash indicates a remote- smoke condition. a beep or chirp occurring virtually simultaneously with an led flash indicates a low-supply condition. a beep occurring half-way between led flashes indicates degraded chamber sensit ivity. a low-supply condition does not affect the smoke detec tion capability if v dd 6 v. therefore, the low-supply condition and degraded chamber sensitiv ity can be further distinguished by performing a push button (chamber) test. features ? circuit is designed to operate in sm oke detector systems that comply with ul217 and ul268 specifications ? operating voltage range: 6 to 12 v ? operating temperature range: - 10 to 60 c ? average supply current: 12 a ? power-on reset places ic in standby mode (non-alarm state) ? electrostatic discharge (esd) and lat ch up protection circuitry on all pins ? chip complexity: 2000 fets, 12 npns, 16 resistors, and 10 capacitors ? ideal for battery powered applications. ordering information device temp. range case no. package mc145010p -55 to +125c 648-08 plastic dip MC145010DW -55 to +125c 751g-04 soic mc145010 photoelectric smoke detector ic with i/o 16-lead plastic dip case 648-08 16-lead soic case 751g-04 figure 1. pin connections c1 c2 detect strobe v dd ired i/o brass test low-supply trip v ss r1 osc led feedback silver 1 2 3 4 5 7 6 89 10 11 12 13 14 15 16
sensors 2 freescale semiconductor mc145010 figure 2. block diagram table 1. maximum ratings (1) (voltages referenced to v ss ) 1. maximum ratings are those values beyond which damage to the device may occur. functional operation should be restricted to t he limits in the electrical c haracteristics tables. rating symbol value unit dc supply voltage v dd -0.5 to +15 v dc input voltage c1, c2, detect osc, low-supply trip i/o feedback test v in -0.25 to v dd +0.25 -0.25 to v dd +0.25 -0.25 to v dd +10 -15 to +25 -1.0 to v dd +0.25 v dc input current per pin i in 10 ma dc output current per pin i out 25 ma dc supply current, vdd and vss pins i dd +25 / -150 ma power dissipation in still air 5 seconds continuous p d 1200 (2) 350 (3) 2. derating: -12 mw/c from 25 to 60c. 3. derating -3.5 mw/c from 25 to 60c. this device contains circuitry to protec t the inputs against damage due to high static vo ltages or electric fields; however, it is advised normal precautions be taken to avoid application of any voltage higher than maximum ra ted voltages to this high impedance circuit. for proper operation, it is recommended v in and v out be constrained to the range v ss (v in or v out ) v dd . mw storage temperature range t stg -55 to +125 c lead temperature, 1 mm from case for 10 seconds t l 5.0 c + - + - detect osc r1 test strobe low-supply trip 3 12 13 16 4 15 2 1 c1 c2 amp comp comp alarm logic horn modulator and driver v dd - 5.0 vref timing logic v dd - 3.5 v ref zero gain low supply smoke gate on/off on/off 8 9 10 6 11 7 pin 5 = v dd pin 14 = v ss ired feedback silver brass i/o gate osc led
sensors freescale semiconductor 3 mc145010 table 2. electrical characteristics (t a = -10 to 60c unless otherwise indicated. voltages referenced to v ss .) characteristics symbol v dd /v dc min typ max unit operating voltage v dd ? 6.0 ? 12.0 v supply threshold voltage, low-supply alarm low-supply trip: vin = vdd/3 v th ? 6.5 ? 7.8 v average operating supply current (per package) standby configured per figure 8 i dd 12.0 ? ? 12.0 a peak supply current (per package) during strobe on, ired off configured per figure 8 during strobe on, ired on configured per figure 8 i dd 12.0 12.0 ? ? ? ? 2.0 3.0 ma low-level input voltage i/o feedback test v il 9.0 9.0 9.0 ? ? ? ? ? ? 1.5 2.7 7.0 v high-level input voltage i/o feedback test v ih 9.0 9.0 9.0 3.2 6.3 8.5 ? ? ? ? ? ? v input current osc, detect ? v in = v ss or v dd low-supply trip ? v in = v ss or v dd feedback ? v in = v ss or v dd i in 12.0 12.0 12.0 ? ? ? ? ? ? 100 100 100 na low -level input current test ? v in = v ss or v dd i il 12.0 ? ? -1.0 a pull-down current test ? v in = v dd i/o ? no local smoke, v in = v dd i/o ? no local smoke, v in = 17 v i ih 9.0 9.0 12.0 0.5 25.0 ? ? ? ? 10 100 140 a low-level output voltage led ? i out = 10 ma silver, brass ? i out = 16 ma v ol 6.5 6.5 ? ? ? ? 0.6 1.0 v high-level output voltage silver, brass ? i out = 16 ma v oh 6.5 5.5 ? ? v output voltage (for line regulations, see pin descriptions) strobe ? inactive, i out = -1 a active, i out = 100 a to 500 a (load regulation) ired ? inactive, i out = 1 a active, i out = 6 a (load regulation) v out ? 9.0 ? 9.0 v dd ? 0.1 v dd ? 4.40 ? 2.25 (1) 1. t a = 25c only. ? v dd ? 5.30 0.1 3.75 1 v high-level output current i/o ? local smoke, v out = 4.5 v i/o ? local smoke, v out = v ss (short circuit current) i oh 6.5 12.0 -4 ? ? -16 ma off-state output leakage current led ? v out = v ss or v dd i oz 12.0 ? ? 1.0 a common mode c1, c2, detect, voltage range ? local smoke, push button test, or chamber sensitivity test v ic ? v dd ? 4 ? v dd ? 2 v smoke comparator internal reference voltage ? local smoke, push button test, or chamber sensitivity test v ref ? v dd ? 3.08 ? v dd ? 3.92 v
sensors 4 freescale semiconductor mc145010 table 3. ac electrical characteristics reference timing diagram figure 6 and figure 7 . (t a = 25c, v dd = 9.0 v, component values from figure 8 : r1 = 100.0 k ? , c3 = 1500.0 pf, r2 = 10.0 m ? .) no. characteristics symbol clocks min max unit 1 oscillator period (1) free-running sawtooth measured at pin 12 1. oscillator period t (= t r + t f ) is determined by the external components r1, r2, and c3 where t r = (0.6931) r 2 x c 3 and t f = (0.6031) r 1 x c 3 . the other timing characteristics are some multiple of the oscillator timing shown in the table. 1/f osc 1 9.5 11.5 ms 2 3 4 led pulse period no local smoke, and no remote smoke remote smoke, but no local smoke local smoke or push button test t led 4096 ? 64 38.9 ? 0.60 47.1 ? 0.74 s 5 led pulse width and strobe pulse width t w(led) , t w(stb) 1 9.5 11.5 ms 6 7 8 ired pulse period smoke test chamber sensitivity test without local smoke push button test t ired 1024 4096 32 9.67 38.9 0.302 11.83 47.1 0.370 s 9 ired pulse width t w(ired) t f 1 94 116 s 10 ired rise time ired fall time t r t f ? ? ? ? 30 200 s 11 silver and brass modulation period local or remote smoke t mod ? 297 363 ms 11 12 silver and brass duty cycle local or remote smoke t on /t mod ? 73 77 % 13 silver and brass chirp pulse period low supply or degraded chamber sensitivity t ch 4096 38.9 47.1 s 14 silver and brass chirp pulse width low supply or degraded chamber sensitivity tw (ch) 1 9.5 11.5 ms 15 rising edge on i/o to smoke alarm response time remote smoke, no local smoke t rr ? ? 800 ms 16 17 18 19 strobe out pulse period smoke test chamber sensitivity test without local smoke low supply test without local smoke push button test t stb 1024 4096 4096 ? 9.67 38.9 38.9 0.302 11.83 47.1 47.1 0.370 s
sensors freescale semiconductor 5 mc145010 table 4. pin description pin symbol description 1 c1 a capacitor connected to this pin, shown in figure 8 , determines the gain of the on-chip photo amplifier during push button test and chamber sensitivity test (high gain). the capacitor va lue is chosen such that the alarm is tripped from background reflections in the chamber during push button test. a v a 1 + (c1/10) where c1 is in pf. caution: t he value of the closed-loop gain should not exceed 10,000. 2 c2 a capacitor connected to this pin as shown in figure 8 determines the gain of the on-chip photo amplifier except during push button or chamber sensitivity tests. a v 1 + (c2/10) where c2 is in pf. this gain increases about 10% during the ired pulse, after two consecutive local smoke detections. resistor r14 must be installed in series with c2. r14 [1/(12 c2)] - 680 where r14 is in ohms and c2 is in farads. 3 detect this input to the high-gain pulse amplifier is tied to t he cathode of an external photodiodes. the photodiodes should have low capacitance and low dark leakage current. the diode must be shunted by a load resistor and is operated at zero bias. the detect input must be ac/dc decoupled from all other signals, v dd , and v ss . lead length and/or foil traces to this pin must be minimized, also. see figure 9 . 4 strobe this output provides a strobed, regulated voltage referenced to v dd . the temperature coefficient of this voltage is 0.2%/ c maximum from - 10 to 60 c. the supply-voltage coeffi cient (line regulation) is 0.2%/v maximum from 6 to 12 v. strobe is tied to external resistor string r8, r9, and r10. 5 v dd this pin is connected to the positive supply potentia l and may range from +6 to +12 v with respect to v ss . caution: in battery-powered applications, reverse-polarity protection must be provided externally. 6 ired this output provides pulsed base current fo r external npn transistor q1 used as t he infrared emitter driver. q1 must have 100. at 10 ma, the temperature coefficient of the output voltage is typically + 0.5%/ c from - 10 to 60 c. the supply- voltage coefficient (line regulation) is 0.2%/v maximum from 6 to 12 v. the ir ed pulse width (active-high) is determined by external components r1 and c3. with a 100 k ? /1500 pf combination, the nominal width is 105 s. to minimize noise impact, ired is not active when the visi ble led and horn outputs are active. ired is active near the end of strobe pulses for smoke tests, chamber sensitivity test, and push button test. 7 i/o this pin can be used to connect up to 40 units together in a wired-or configuration for common signaling. v ss is used as the return. an on-chip current sink minimizes noise pick up during non-smoke conditions and eliminates the need for an external pull-down resistor to complete the wired-or. remote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. i/o can also be used to activate escape lights, auxil iary alarms, remote alarms, and/or auto-dialers. as an input, this pin feeds a positive-edge-triggered flip-fl op whose output is sampled nominally every 625 ms during standby (using the recommended component values). a local-smok e condition or the push button-test mode forces this current-limited output to source current. all input signals are ignored when i/o is sourcing curr ent. i/o is disabled by the on-chip power-on reset to eliminate nui sance signaling during battery changes or system power-up. if unused, i/o must be left unconnected. 8 brass this half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer and to the horn-starting resistor. a continuous modulated tone from the transducer is a smoke alarm indicating either local or remote smoke. a short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. 9 silver this half of the push-pull driver output is connected to the ce ramic electrode of a piezoelectr ic transducer and to the horn- starting capacitor. 10 feedba ck this input is connected to both the feedback electrode of a se lf-resonating piezoelectric tr ansducer and the horn-starting resistor and capacitor through current-limiting resi stor r4. if unused, this pin must be tied to v ss or v dd . 11 led this active-low open-drain output directly drives an external visible led at the pul se rates indicated below. the pulse width is equal to the osc period. the load for the low-supply test is applied by this output. th is low-supply test is non-coin cident with the smoke tests, chamber sensitivity test, push button test, or any alarm signals. the led also provides a visual indication of the detector st atus as follows, assuming the component values shown in figure 8 : standby (includes low-supply and chamber sensitivity tests) - pulses every 43 seconds (nominal) local smoke - pulses every 0.67 seconds (nom inal) remote smoke - no pulses push button test - pulses every 0.67 seconds (nominal) 12 osc this pin is used in conjunction with external resistor r2 (10 m ? ) to v dd and external capacitor c3 (1500 pf) to v dd to form an oscillator with a nominal period of 10.5 ms. 13 r1 this pin is used in conjunct ion with resistor r1 (100 k ? ) to pin 12 and c3 (1500 pf, see pin 12 description) to determine the ired pulse width. with this rc comb ination, the nominal pulse width is 105 s. 14 vss this pin is the negative supply potential and the return for the i/o pin. pin 14 is usually tied to ground. 15 low- supply trip this pin is connected to an external volt age which determines the low-supply alarm th reshold. the trip voltage is obtained through a resistor divider connected between the v dd and led pins. the low-supply alarm threshold voltage (in volts) (5r7/r6) + 5 where r6 and r7 are in the same units.
sensors 6 freescale semiconductor mc145010 figure 3. ac characteristics vs. supply figure 4. ac characteristics vs. temperature figure 5. rc component variation overtemperature 16 test this input has an on-chip pull-down device and is used to manually invoke a test mode. the push button test mode is initiated by a high level at pin 16 (usually depression of a s.p.s.t. normally-open push button switch to v dd ). after one oscillator cycle, ired pulses approximately every 336 ms, r egardless of the presence of sm oke. additionally, the amplifier gain is increased by automatic selecti on of c1. therefore, the background reflections in the smoke chamber may be interpreted as smoke, generating a simulated-smoke condition. after the second ired pulse, a successful test activates the horn-driver and i/o circuits . the active i/o allows remote signaling for system testing. when the push button test switch is released, the test input returns to v ss due to the on-chip pull-down device. a fter one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated-sm oke condition. after two additi onal ired pulses, less than a second, the ic exits the alarm mode and returns to standby timing. table 4. pin description (continued) pin symbol description pulse width of ired period or pulse width of other parameters ac parameter (normalized to 9.0 v value) v dd , power supply voltage (v) 1.02 0.98 0.96 1.00 1.04 6.0 7.0 8.0 9.0 10.0 12.0 11.0 p ulse width of ired period or pulse width of other parameters ac parameter (normalized to 25c value) t a , ambient temperature (c) -10 0 10 20 40 50 60 1.02 1.01 0.99 0.98 1.00 30 v dd = 9.0 v 10 m ? carbon composition 100 k ? metal film 1500 pf dipped mica component value (normalized to 25 c value) t a , ambient temperature (c) -10 0 10 20 30 40 50 60 1.03 1.02 1.01 1.00 0.99 0.98 note: these components were used to generate figure 3.
sensors freescale semiconductor 7 mc145010 figure 6. standby timing diagram low supply test (internal) smoke test (internal) chamber test (internal) osc (pin 12) 1 led (pin 11) silver, brass (internal) enable no low supply chirps ired ( pin 6) strobe (pin 4) 6 6 16 5 14 notes: numbers refer to the ac electrical characteristics table. illustration is not to scale. chamber sensitivity ok i ndicate low supply chirps indicate degraded chamber sensitivity 9 13 13 18 17 7 2 power-on reset
sensors 8 freescale semiconductor mc145010 figure 7. smoke timing diagram low supply test (internal) ired (pin 6) chamber test (internal) strobe (pin 4) i/o (pin 7) silver, brass (not performed) (not performed) 11 10 9 ired 10% 90% 5 19 led (pin 11) 5 (no pulses) (as input) (as output) (as output) enable (internal) 15 12 11 no smoke pushbutton local smoke (remote smoke = don't care) remote smoke (no local smoke) 4 notes: numbers refer to the ac electrical characteristics table. illustration is not to scale. test 4 3 no smoke 6 8
sensors freescale semiconductor 9 mc145010 figure 8. typical battery-powered application calibration to facilitate checking the se nsitivity and calibrating smoke detectors, the mc145010 can be placed in a calibration mode. in this mode, certain device pins are controlled/ reconfigured as shown in ta b l e 5 . to place the part in the calibration mode, pin 16 (test) must be pulled below the v ss pin with 100 a continuously drawn out of the pin for at least one cycle on the osc pin. to exit this mode, the test pin is floated for at least one osc cycle. in the calibration mode, the ired pulse happens at every clock cycle and strobe is alwa ys on (active low). also, low battery and supervisory tests are disabled in this mode. 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 test low-supply trip v ss r1 osc led feedback silver v dd ired i/o brass strobe detect c1 c2 horn x1 to other mc145010(s), escape light(s), auxiliary alarm(s), remote alarm(s), and/or auto-dialer ir current r13* 4.7 to 22 q1 2.2 m r5 ! d4 visible led r7 47 k r6 100 k sw1 + + mc145010 reverse polarity protection circuit pushbutton test r2 10 m 0.01 f c6 ! c3 1500 pf r1 100 k r3 470 r4 ! 100 k 9.0 v b1 d1 1 to 22 f c4** c1 0.047 f c2* 4700 pf r14 560 ? r11 250 k d2 ir detector r8 8.2 k r9 ? 5.0 k r10 4.7 k d3 ir emitter r12 1.0 k c5 100 f ! values for r4, r5, and c6 may differ depending on type of piez oelectric horn used. * c2 and r13 are used for coarse sensitiv ity adjustment. typica l values are shown. ? r9 is for fine sensitivity adjustment (opt ional). if fixed resistors are used, r8 = 12 k, r10 is 5.6 k to 10 k, and r9 is eli minated. when r9 is used, noise pickup is increased due to antenna effects. shielding may be required. **c4 should be 22 f if b1 is a carbon battery. c4 could be reduced to 1 f when an alkaline battery is used.
sensors 10 freescale semiconductor mc145010 figure 9. recommended pcb layout table 5. configuration of pins in the calibration mode description pin comment i/o 7 disabled as an output. forcing this pin high places the photo amp output on pin 1 or 2, as determined by low-supply trip. the amp's output appear s as pulses and is referenced to v dd . low-supply trip 15 if the i/o pin is high, pin 15 cont rols which gain capacitor is used. low: normal gain, amp output on pin 1. high: supervisory gain, amp output on pin 2. feedback 10 driving this input high enables hy steresis (10% gain increase) in the photo amp; pin 15 must be low. osc 12 driving this input high brings the in ternal clock high. driving the input lo w brings the internal clock low. if desired, the rc network for the oscillator may be left inta ct; this allows the oscillator to run similar to the normal mode of operation. silver 9 this pin becomes the smoke comparator output. when the osc pin is toggling, positi ve pulses indicate that smoke has been detected. a static low level indicates no smoke. brass 8 this pin becomes the smoke integrator output. that is , two consecutive smoke de tections are required for on (static high level) and two consecutive no-detections for ?off? (static low level). pin 8 pin 16 pin 9 pin 1 c1 r11 d2 r8 mounted in chamber c2 r10 do not run any additional traces in this region c2 r14 notes: illustration is bottom view of layout using a dip. top view for soic layout is mirror image. optional potentionmeter r9 is not illustrated. drawing is not to scale. leads on d2, r11, r8, and r10 and their associated traces must be kept as short as possible. this practice minimizes noise pick -up. pin 3 must be decoupled from all other traces.
sensors freescale semiconductor 11 mc145010 case 648-08 issue r 16-lead plastic dip notes: 1. 2. 3. 4. 5. 6. dimensions are in millimeters. dimensioning and tolerancing per asme y14.5m, 1994. datums a and b to be determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include mold flash, protrusion or gate burrs. mold flash, protrustion or gate burrs shall not exceed 0.15mm per side. this dimension is determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25mm per side. this dimension is determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include dambar protrusion. allowable dambar protrusion shall not cause the lead width to exceed 0.62mm. seating plane 0.49 16x b m 0.25 a t 0.35 2.65 2.35 0.25 0.10 6 t 16x 0.1 t 1.27 14x 89 1 16 8x 10.55 10.05 m 0.25 b 4 10.45 10.15 a 7.6 7.4 b pin 1 index pin's number 5 a a 0.75 x45 ? 0.25 7? 1.0 0.4 0? 0.32 0.23 section a-a case 751g-04 issue d 16-lead soic notes: 1. 2. 3. 4. 5. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension l to center of leads when formed parallel. dimension b does not include mold flash. rounded corners optional. -a- b f c s h g d 16 pl j l m seating plane 18 9 16 k -t- m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 010010 s 0.020 0.040 0.51 1.01 style 1: pin 1. cathode 2. cathode 3. cathode 4. cathode 5. cathode 6. cathode 7. cathode 8. cathode 9. anode 10. anode 11. anode 12. anode 13. anode 14. anode 15. anode 16. anode style 2: pin 1. common drain 2. common drain 3. common drain 4. common drain 5. common drain 6. common drain 7. common drain 8. common drain 9. gate 10. source 11. gate 12. source 13. gate 14. source 15. gate 16. source package dimensions
how to reach us: home page: www.freescale.com e-mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) support@freescale.com japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com mc145010 rev. 6 05/2005 information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2005. all rights reserved.

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